Modern tech is noise. GHOST IS THE CURE. A Sovereign Layer: User-First, Local-First, Voice-First. This credit-card-sized cellular engine executes intent across every platform you own without cloud intermediaries.

AUTONOMOUS. ADAPTIVE. ABSOLUTE.

ONBOARD AI

Full-function, local-first intelligence. Zero lag.

COMMS

Always connected: Cellular, Wi-Fi, and BT.

LOGISTICS

Book travel. Fill forms. Auto-resolve itineraries.

OFFICE

Sync workflow across platforms in GROUP node.

COMMERCE

Voice-auth find, add, captcha, checkout, returns.

IOT

Master key for all peripherals, home and office.

Stop the noise Page 2 comparison

GHOST doesn't compete for attention; it executes intent.

UNIVERSAL HANDSHAKE

One interface. Every platform. Orchestrate your workflow by voice. Ghost drives software across Apple, Google, Microsoft, Linux, and Android without hopping between apps or devices.

DETERMINISTIC SYNC

Ghost coordinates your software and hardware across computers, printers, smart home, and connected devices. Predictive, context-aware autonomy resolves the workflow and confirms the task is closed.

SOVEREIGN LAYER

Zero footprint. Local power. Your voice and encryption keys stay on-device. Insert your SIM for full cellular autonomy. Credit-card size; command-center utility.

SYSTEM CONTROL

Local execution of voice intent and service orchestration.

IC: ESP32-S3-WROOM-1U (Dual-Core)

Memory: 8MB PSRAM / 8MB Flash

Ref: LCSC C3013946

GLOBAL AGENT

Autonomous LTE-M/NB-IoT connectivity for cross-border sync.

Module: SIM7080G (Multi-Band)

RF Path: 50Ohm Impedance Controlled

Ref: LCSC C2943992

NANOSIM

Use your existing SIM card for all CDN/US carriers. Full-function voice-activated phone.

Slot: SIM8060-6-0-14-00-A

Format: NanoSIM

Ref: LCSC C6296715

SENSORY I/O

High-fidelity I2S digital audio capture and reproduction.

Mic: ICS-43434 (Digital MEMS)

Amp: MAX98357A (3.2W Class D)

Ref: LCSC C5656610 / C910544

SOUND

External dynamic driver for robust comms.

Driver: XHXDZ 20MM-8OHM 1W

Type: Dynamic Speaker

Ref: LCSC C49246988

USB-C CHARGING

Reinforced Type-C port with intelligent charging.

Connector: USB-C 3.1 (Reinforced)

Ref: LCSC C223907

LiPo BATTERY

High-density battery pack for extended runtime.

Capacity: 1000mAh

Voltage: 3.7V Nominal

Ref: Custom Sourced

CAMERA

High-resolution imaging for visual coordination and data capture.

IC: OV2640

Resolution: 2MP

Ref: LCSC C5362175

HAPTIC TOUCH PADS

Capacitive touch test points for responsive user interaction.

Type: Capacitive Touch

Pads: TP1, TP2

Status: Test Points

INTEGRITY

Tamper-resistant power protection and storage isolation for the vault layer.

TVS: SRV05-4 (ESD Diode Array)

LDO: XC6210B332MR-G (3.3V)

Standard: Failure-Immune Design.

Ref: LCSC C2836319

MICROSD STORAGE

Encrypted microSD vault for local storage, scheduled wipes, and no-leak retention.

Interface: SPI / SDIO Compatible

Capacity: Up to 256GB

Standard: Encrypted File Vault

Ref: Custom Secure Storage

BATCH 01 - FOUNDER'S RELEASE

Limited to 100 units. Built for early operators of the User Aligned Layer and assembled on a high-precision production line.

Price: $299

Status: In Production (Batch 01 of 100)

Includes: Hand-assembled 4.1mm Ghost V1 hardware + Lifetime Black Room access + sovereign code and logic + schematics

UPCOMING

GHOST MASS RELEASE

General release follows after optimization and scale-up. Join the waiting list to be notified when standard production opens.

Status: Optimization Phase

Access: Standard Tier

Enter handshake for the Black Room

Proudly developed in collaboration with

FOUNDERS' ACCESS

THE BLACK ROOM // INTERNAL_SOURCE

VERIFIED FOUNDER ACCESS ONLY // GHOST_V1
[ ENCRYPTION: AES-256-GCM ]

01 // THE_PILLARS

Raw C source for the iCloud/CalDAV handshake. No stubs. Implementation of apple_calendar_client.c with raw HTTP PROPFIND logic.

TYPE: SOURCE_CODE

02 // SCHEMATICS

Full KiCad project files. 0.8mm stackup data. Resin-filled via-in-pad specifications for the Flora-line production run.

TYPE: HARDWARE_EDA

03 // THE_LOGS

Documentation of the desoldering process. Removing SIM slots and plastic headers to achieve the 4.2mm form factor.

TYPE: ENGINEERING_DEVLOG

[ INITIATE_THE_FORGE ]

Submit deterministic functions. If it requires a cloud intermediary, it will be rejected. Build for the Layer.